•  Optical Inspection - Optical inspection and image documentation of package-level device failures and anomalies. •  X-ray - Non-destructive inspection of wire bond, solder bump, and PCB with image documentation capability. •  SEM - Scanning Electron Microscopy - Surface analysis and image documentation of samples at magnifications from 250 to 100K. •  SAM - Scanning Acoustic Microscopy - Non-destructive imaging using ultrasonic waves to detect delamination, voiding, and features present in a sample. •  Emission Microscopy - Transistor level detection of photon emissions to locate die level failures. •  FIB - Focused Ion Beam - Design repair, probe pad deposition and circuit isolation. •  Elemental Analysis - Elemental mapping using backscattered or secondary electron imaging. •  Electrical Characterization - Curve trace analysis of samples to verify failure mode and isolate failure mechanism. •  Electrical Isolation - Isolation of failure site using liquid crystal microscopy. •  Decapsulation - Decapsulation using acid jet fuming nitric and/or fuming sulfuric acid. •  Deprocessing - Layer-by-layer deprocessing to substrate using wet etching and/or dry etching. •  Cross-Sectioning - Analysis of the internal structure of samples by utilizing a wide range of polishing techniques. •  Materials Analysis - Sample preparation and backscattered images analysis. •  Time Domain Reflectometry (TDR) Analysis - Non-destructively determine the location of a continuity failure within a conductor.