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Priority Labs specializes in failure analysis. Because of this, Priority Labs has a range of services and expertise that are dedicated to fault isolation. Failures can be localized using liquid crystal which will detect any localized heating due to a failure mechanism such as junction damage, gate oxide rupture, reflowed metallization due to over-current events, bridged metal interconnects, polysilicon filaments, electrostatic discharge (ESD) damage, electrical overstress (EOS) damage, and much more. Priority Labs provides in-depth nodal analysis of circuits by utilization the focused ion beam (FIB) for performing probe pad deposition to access internal nodes and microprobing using our extensive selection of probe stations (with cold temperature capability and integrated dark boxes). Priority Labs is capable of probing small device geometries using 500 nm probe tips. Flip chip and wafer chip scale packages (WCSP) failures can be localized using our expertise in back-side preparation and back-side fault localization tools.
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